3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate
Epoxy resin intermediate; food packaging material coating; can be used for light modeling, making medical model; electronic material intermediate; automobile primer; high voltage cable.
| Payment & Shipping Terms | Supply Capacity | ||
|---|---|---|---|
| Payment Terms: | T/T, WU | Production Capacity: | 100T/year |
| Min. Order: | 25KG | Packing: | according to the customer's requirements |
| Means of Transport: | Ocean, Air, Land | Delivery Date: | 7 days |
3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate
CAS 2386-87-0
Epoxy resin intermediate; food packaging material coating; can be used for light modeling, making medical model; electronic material intermediate; automobile primer; high voltage cable.
We can customize according to customer's requirement
If you have any question pls mail us or call us.
| CAS Number | 2386-87-0 |
|---|---|
| Molecular Formula | C14H20O4 |
| Molecular Weight | 252.31 |
| Place of Origin | Sichuan,China (Mainland) |
Send an inquiry for 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate
Related products
1,2-Dimethylimidazole
Imidazole catalyst evaluated for epoxy cure control; selection depends on assay, moisture, resin chemistry, cure schedule and required latency.
1,3,5-Triglycidyl Isocyanurate
It is mainly used as curing agent of polyester powder, and can also be used to make electrical insulation material laminate, printed circuit, various tools, adhesives, plastic stabilizers, etc
1-Methylimidazole
Its appearance is colorless and transparent liquid, melting point: - 60 ℃, boiling point: 198 ℃, density D20 / 4 = 1.036g/ml. Content: ≥ 99%. It is mainly used as curing agent for epoxy resin and other resins, as well as for pouring, bonding, FRP and other fields.
2-Ethyl-4-methylimidazole
Light yellow crystal. Melting point 45 ℃, boiling point 292-295 ℃, 154 ℃ (1.33kpa), relative density 0.975 (45 ℃), refractive index 1.4995, flash point 137 ℃. The product is a good curing agent, used to prepare epoxy adhesive, epoxy silicone resin coating, etc.
3-(2-Methyl-1H-imidazol-1-yl)propanenitrile
We can customize according to customer's requirement
4,4'-Methylenedianiline
It is mainly used in the manufacture of high polymer materials such as epoxy resin, polycarbonate, polysulfone resin, phenolic unsaturated resin, polyetherimide, etc. it can also be used in the manufacture of PVC heat stabilizer, plasticizer, rubber antioxidant, agricultural bactericide, paint, UV absorber.
Cis-1,2,3,6-Tetrahydrophthalic Anhydride
As the intermediate of organic synthesis raw materials, tetrahydrophthalic anhydride is generally used to produce alkyd resin, unsaturated polyester resin, coating, curing agent of epoxy resin, insecticide, curing regulator, plasticizer and surfactant. Tetrahydrophthalic anhydride, as the raw material for the production of unsaturated polyester resin, mainly improves the air dryness of the resin, especially in the production of high-grade resin atomic ash and air dry coating.
Epoxy Resins
All the polymer compounds containing epoxy group in molecular structure are called epoxy resin. The cured epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small variable shrinkage, good dimensional stability of products, high hardness, good flexibility, and stability to alkali and most solvents. Therefore, it is widely used in various departments of national defense and national economy for pouring, impregnation, laminating materials Adhesive, coating and other applications. Epoxy resin has been studied since 1958 in China, and it has been put into industrial production at a very fast speed. Up to now, it has developed vigorously all over the country. In addition to the production of ordinary bisphenol a-epichlorohydrin epoxy resin, various types of new epoxy resin are also produced to meet the urgent needs of national defense construction and national development and economic departments. The preparation methods of epoxy resin are as follows: reaction of active hydrides with epichlorohydrin, liquid-phase oxidation of double bond by hydrogen peroxide or peracetic acid (for example, peracetic acid), air oxidation of double bond compounds.
